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Broadcom Delivers Industry's First 3.5D F2F Technology for AI XPUs


Published on 2024-12-07 10:00:59 - The Globe and Mail
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  • PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP
  • ) platform technology, enabling consumer AI customers to develop next-generation ...





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